Intel announced a major rethink of its chip design back in December, just before it finally delivers 10nm chips for PCs and laptops. At CES 2019 this week, Intel is demonstrating its first Ice Lake 10nm processor that’s based on its new Sunny Cove microarchitecture. From a report: Intel is building in Thunderbolt 3, Wi-Fi 6, and DL Boost (deep learning boost) into these Ice Lake chips for laptops and PCs to take advantage of. Intel is now promising that PC makers will have devices with Ice Lake processors on shelves by the end of 2019. At its CES keynote today, Intel demonstrated ODM systems from Pegatron and Wistron, and Dell even joined Intel on stage to show off an Ice Lake-powered XPS laptop that will be available later this year. Dell didn’t show the device powered on, but it appeared to be a 2-in-1 device that looked similar to the XPS 13. Intel is also looking to the future, too. The chip giant is planning to use Foveros 3D chip stacking technology to build future chips, a method that allows Intel’s chip designers to stack extra processing power on top of an already-assembled chip die. These “chiplets” can be stacked atop one another to form a processor that includes graphics, AI processing, and more.
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